View BU4329G-TR_7409855.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

product structure silicon monolithic integrated circuit this product is not designed for pr otection against radioactive rays . 1/13 datashee t tsz02201-0r7r0g300050-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.aug.2013 rev.007 tsz22111 ? 14? 001 www.rohm.com voltage detector ic series low voltage free delay time setting cmos voltage detector ic series bu42xx series bu43xx series general description rohm?s bu42xx and bu43xx series are cmos voltage detector ics with adjustable output delay. it is a high-accuracy, low current consumption voltage detector ic series with a built-in delay circuit. the lineup was established with two output types (nch open drain and cmos output) and detection volt ages range from 0.9v to 4.8v in increments of 0.1v, so that the series may be selected according to application. features ? delay time controlled by external capacitor ? two output types (nch open drain and cmos output) ? ultra-low current consumption ? wide operating temperature range ? very small and low height package ? package ssop5 and sop4 is similar to sot-23-5 and sc-82 respectively (jedec) key specifications ? detection voltage: 0.9v to 4.8v (typ.) 0.1v steps ? high accuracy detection voltage: 1.0% ? ultra-low current consumption: 0.55a (typ.) ? operating temperature range: -40c to +125c package ssop5: 2.90mm x 2.80mm x 1.25mm sop4: 2.00mm x 2.10mm x 0.95mm vsof5: 1.60mm x 1.60mm x 0.60mm applications circuits using microcontrollers or logic circuits that require a reset. typical application circuit connection diagram & pin descriptions ssop5 sop4 vsof5 pin no. symbol function pin no. symbol function pin no. symbol function 1 v out reset output 1 gnd gnd 1 v out reset output 2 v dd power supply voltage 2 v dd power supply voltage 2 sub substrate* 3 gnd gnd 3 c t capacitor connection terminal for output delay time 3 c t capacitor connection terminal for output delay time 4 n.c. unconnected terminal 4 v out reset output 4 v dd power supply voltage 5 c t capacitor connection terminal for output delay time 5 gnd gnd v dd1 bu42xx v dd2 gnd c l (capacitor for noise filtering) c t r l c in r st micro controller open drain output type bu42xx series v dd1 bu43xx c in gnd c t c l (capacitor for noise filtering) r st micro controller cmos output type bu43xx series top view top view top view *connect the substrate to v dd gnd v dd c t v out 1 2 3 4 marking lot. no v out v dd gnd n.c. c t lot. no marking v dd v out sub c t gnd 4 3 2 1 5 marking lot. no
datasheet datasheet 2/13 bu42xx series bu43xx series tsz02201-0r7r0g300050-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.aug.2013 rev.007 www.rohm.com tsz22111 ? 15? 001 ordering information (unit : mm) sop4 2.1 0.2 0.05 1.3 2.0 0.2 12 43 1.25 +0.2 ?0.1 4 +6 0.27 0.15 ?4 0.13 +0.05 ?0.03 0.90.05 0.05 0.05 1.05max. 0.32 +0.05 ?0.04 0.42 +0.05 ?0.04 s 0.1 s (unit : mm) vsof5 1.2 0.05 4 3 1.0 0.05 1 0.6max 0.22 0.05 0.5 5 1.6 0.05 0.13 0.05 0.2max 2 1.6 0.05 (max 1.28 include burr) (unit : mm) ssop5 2.90.2 0.13 4 + 6 ?4 1.6 2.80.2 1.10.05 0.050.05 +0.2 ?0.1 +0.05 ?0.03 0.42 +0.05 ?0.04 0.95 5 4 12 3 1.25max. 0.2min. 0.1 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin buxxxx x-tr part output type reset voltage value package packaging and number 42 : open drain 09 : 0.9v g : ssop5 forming specification 43 : cmos 0.1v step f : sop4 tr : embossed tape 48 : 4.8v fve : vsof5 and reel
datasheet datasheet 3/13 bu42xx series bu43xx series tsz02201-0r7r0g300050-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.aug.2013 rev.007 www.rohm.com tsz22111 ? 15? 001 lineup output type open drain cmos detection voltage marking part number marking part number 4.8v zr bu4248 1h bu4348 4.7v zq bu4247 1g bu4347 4.6v zp bu4246 1f bu4346 4.5v zn bu4245 1e bu4345 4.4v zm bu4244 1d bu4344 4.3v zl bu4243 1c bu4343 4.2v zk bu4242 1b bu4342 4.1v zj bu4241 1a bu4341 4.0v zh bu4240 0z bu4340 3.9v zg bu4239 0y bu4339 3.8v zf bu4238 0x bu4338 3.7v ze bu4237 0w bu4337 3.6v zd bu4236 0v bu4336 3.5v zc bu4235 0u bu4335 3.4v zb bu4234 0t bu4334 3.3v za bu4233 0s bu4333 3.2v yz bu4232 0r bu4332 3.1v yy bu4231 0q bu4331 3.0v yx bu4230 0p bu4330 2.9v yw bu4229 0n bu4329 2.8v yv bu4228 0m bu4328 2.7v yu bu4227 0l bu4327 2.6v yt bu4226 0k bu4326 2.5v ys bu4225 0j bu4325 2.4v yr bu4224 0h bu4324 2.3v yq bu4223 0g bu4323 2.2v yp bu4222 0f bu4322 2.1v yn bu4221 0e bu4321 2.0v ym bu4220 0d bu4320 1.9v yl bu4219 0c bu4319 1.8v yk bu4218 0b bu4318 1.7v yj bu4217 0a bu4317 1.6v yh bu4216 zz bu4316 1.5v yg bu4215 zy bu4315 1.4v yf bu4214 zx bu4314 1.3v ye bu4213 zw bu4313 1.2v yd bu4212 zv bu4312 1.1v yc bu4211 zu bu4311 1.0v yb bu4210 zt bu4310 0.9v ya bu4209 zs bu4309
datasheet datasheet 4/13 bu42xx series bu43xx series tsz02201-0r7r0g300050-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.aug.2013 rev.007 www.rohm.com tsz22111 ? 15? 001 absolute maximum ratings parameter symbol limit unit power supply voltage v dd -0.3 to +7 v output voltage nch open drain output v out gnd-0.3 to +7 v cmos output gnd-0.3 to v dd +0.3 output current io 70 ma power dissipation ssop5(sot-23-5) *1*4 pd 540 mw sop4(sc-82) *2*4 400 vsof5 *3*4 210 operation temperature range t opt -40 to +125 c ambient storage temperature tstg -55 to +125 c *1 reduced by 5.4mw/c when used over 25c. *2 reduced by 4.0mw/c when used over 25c. *3 reduced by 2.1mw/c when used over 25c. *4 when mounted on rohm standard circuit board (70mm70mm1.6mm, glass epoxy board). electrical characteristics (unless othe rwise specified ta=-25 to 125c) parameter symbol condition limit unit min. typ. max. detection voltage v det v dd =h ? l, ta=25c, r l =470k ? v det (t) 0.99 v det (t) v det (t) 1.01 v vdet=1.8v ta=+25c 1.782 1.8 1.818 ta=-40c to 85c 1.741 - 1.860 ta=85c to 125c 1.731 - 1.870 vdet=2.5v ta=+25c 2.475 2.5 2.525 ta=-40c to 85c 2.418 - 2.584 ta=85c to 125c 2.404 - 2.597 vdet=3.0v ta=+25c 2.970 3.0 3.030 ta=-40c to 85c 2.901 - 3.100 ta=85c to 125c 2.885 - 3.117 vdet=3.3v ta=+25c 3.267 3.3 3.333 ta=-40c to 85c 3.191 - 3.410 ta=85c to 125c 3.173 - 3.428 vdet=4.2v ta=+25c 4.158 4.2 4.242 ta=-40c to 85c 4.061 - 4.341 ta=85c to 125c 4.039 - 4.364 circuit current when on i dd 1 v dd =v det -0.2v v det =0.9 to 1.3v - 0.15 0.88 a v det =1.4 to 2.1v - 0.20 1.05 v det =2.2 to 2.7v - 0.25 1.23 v det =2.8 to 3.3v - 0.30 1.40 v det =3.4 to 4.2v - 0.35 1.58 v det =4.3 to 4.8v - 0.40 1.75 circuit current when off i dd 2 v dd =v det +2.0v v det =0.9 to 1.3v - 0.30 1.40 a v det =1.4 to 2.1v - 0.35 1.58 v det =2.2 to 2.7v - 0.40 1.75 v det =2.8 to 3.3v - 0.45 1.93 v det =3.4 to 4.2v - 0.50 2.10 v det =4.3 to 4.8v - 0.55 2.28 operating voltage range v opl v ol 0.4v, ta=25 to 125c, r l =470k ? 0.70 - - v v ol 0.4v, ta=-40 to 25c, r l =470k ? 0.90 - - ?high? output voltage (pch) v oh v dd =4.8v, i source = 1.7 ma ,v det = 0.9v to 3.9v vdd-0.5 - - v v dd =6.0v, i source = 2.0 ma ,v det = 4.0v to 4.8v vdd-0.5 - - v ?low? output voltage (nch) v ol v dd =0.85v, i sink = 20 a - - 0.05 v v dd =1.5v, i sink = 1 m a, v det =1.7 to 4.8v - - 0.5 v v dd =2.4v, i sink = 3.6 m a, v det =2.7 to 4.8v - - 0.5 *1: design guarantee. (outgoing ins pection is not done on all products.) v det (t) : standard detection voltage (0.9v to 4.8v, 0.1v step) r l : pull-up resistor to be connected between v out and power supply.
datasheet datasheet 5/13 bu42xx series bu43xx series tsz02201-0r7r0g300050-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.aug.2013 rev.007 www.rohm.com tsz22111 ? 15? 001 electrical characteristics (unless otherwise specified ta=-25 to 125c) - continued parameter symbol condition limit unit min. typ. max. leak current when off i leak v dd =v ds =7v ta=-40 to 85c - 0 0.1 a v dd =v ds =7v ta=85 to 125c - 0 1 ct pin threshold voltage v cth v dd =v det 1.1, v det =0.9 to 2.5v ta=25c r l =470k ? v dd 0.35 v dd 0.45 v dd 0.55 v v dd =v det 1.1, v det =2.6 to 4.8v ta=25c r l =470k ? v dd 0.40 v dd 0.50 v dd 0.60 output delay resistance r ct v dd =v det 1.1 v ct =0.5v ta=25c *1 9 10 11 m ? ct pin output current i ct v ct =0.1v v dd =0.85v 5 40 - a v ct =0.5v v dd =1.5v v det =1.7 to 4.8v 200 400 - detection voltage temperature coefficient v det / ? t ta=-40c to 125c - 30 - ppm/c hysteresis voltage ? v det v dd =l ? h ? l ta=-40 to 125c r l =470k ? v det 1.0v v det 0.03 v det 0.05 v det 0.08 v v det 1.1v v det 0.03 v det 0.05 v det 0.07 *1: design guarantee. (outgoing ins pection is not done on all products.) v det (t) : standard detection voltage (0.9v to 4.8v, 0.1v step) r l : pull-up resistor to be connected between v out and power supply.
datasheet datasheet 6/13 bu42xx series bu43xx series tsz02201-0r7r0g300050-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.aug.2013 rev.007 www.rohm.com tsz22111 ? 15? 001 block diagrams vref v out v dd gnd ct fig.1 bu42xx series vref v out v dd gnd ct fig.2 bu43xx series
datasheet datasheet 7/13 bu42xx series bu43xx series tsz02201-0r7r0g300050-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.aug.2013 rev.007 www.rohm.com tsz22111 ? 15? 001 typical performance curves fig.3 circuit current 0.0 0.1 0.2 0.3 0.4 0.5 0.6 01 23 45 67 v dd supply voltage v dd [v] circuit current i dd [ a] 0 1 2 3 4 5 0.0 0.5 1.0 1.5 2.0 2.5 drain-source voltage v ds [v] "low" output current i ol [ma] v dd =1.2 v bu4216f fig.4 ?low? output current 0 5 10 15 20 25 0123456 drain-source voltage v ds [v] "high" output current i oh [ma] bu4318g v dd =6.0v v dd =4.8v fig.5 ?high? output current fig.6 i/o characteristics 0 1 2 3 4 5 6 7 01234567 v dd supply voltage v dd [v] output voltage v out [v] bu4216f bu4216 bu4316 bu4318 bu4216 bu4316 bu4216 bu4316
datasheet datasheet 8/13 bu42xx series bu43xx series tsz02201-0r7r0g300050-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.aug.2013 rev.007 www.rohm.com tsz22111 ? 15? 001 typical performance curves ? continued 0.0 0.1 0.2 0.3 0.4 0.5 -40 0 40 80 120 temperature ta[ ] circuit current when on i dd1 [ a] bu4216f fig.10 circuit current when on fig.9 detecting voltage release voltage 1.0 1.5 2.0 -40 0 40 80 120 temperature ta[ ] detection voltage v det [v] low to hig h( v det + v det ) hig h to low(v det ) bu4216f 0.0 0.2 0.4 0.6 0.8 1.0 0.0 0.5 1.0 1.5 2.0 2.5 v dd supply voltage v dd [v] output voltage v out [v] bu4216f fig.7 operating limit voltage 0 100 200 300 400 500 600 700 00.5 11.5 22.5 v dd supply voltage v dd [v] ct output current i ct [ a] bu4216f fig.8 ct terminal current bu4216 bu4316 bu4216 bu4316 bu4216 bu4316 bu4216 bu4316
datasheet datasheet 9/13 bu42xx series bu43xx series tsz02201-0r7r0g300050-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.aug.2013 rev.007 www.rohm.com tsz22111 ? 15? 001 typical performance curves ? continued 0.0 0.5 1.0 -40 0 40 80 120 temperature ta[ ] minimum operating voltage v opl [v] bu4216f fig.12 operating limit voltage 0 2 4 6 8 10 12 14 16 18 - 40 0 40 80 120 temperature ta[ ] resistance of ct r ct [m ] bu4216f fig.13 c t terminal circuit resistance 0.001 0.01 0.1 1 10 100 1000 10000 0.0001 0.001 0.01 0.1 capacitance of ct c ct [ f] delay time t plh [ms] bu4216f fig.14 delay time (t plh ) and c t terminal external capacitance 0.0 0.2 0.4 0.6 0.8 1.0 -40 0 40 80 120 temperature ta[ ] circuit current when off i dd2 [ a] bu4216f fig.11 circuit current when off bu4216 bu4316 bu4216 bu4316 bu4216 bu4316 bu4216 bu4316
datasheet datasheet 10/13 bu42xx series bu43xx series tsz02201-0r7r0g300050-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.aug.2013 rev.007 www.rohm.com tsz22111 ? 15? 001 application information explanation of operation for both the open drain type (fig.15) and the cmos output type (fig.16), the detection and release voltages are used as threshold voltages. when the voltage applied to the v dd pins reaches the applicable threshold voltage, the vou t terminal voltage switches from either ?high? to ?low? or from ?low? to ?high?. bu42xx and bu43xx series have delay time function which set t plh (output ?low? ? ?high?) using an external capacitor (c ct ). because the bu42xx series uses an open drain output type, it is necessary to connect a pull-up resistor to v dd or another power supply if needed [the output ?high? voltage (v out ) in this case becomes v dd or the voltage of the other power supply]. fig.15 (bu42xx series internal block diagram) fig.16 (bu43xx type internal block diagram) setting of detector delay time the delay time of this detector ic can be set at the rise of v dd by the capacitor connected to c t terminal. delay time at the rise of v dd t plh :time until when vou t rises to 1/2 of v dd after v dd rises up and beyond the release voltage(v det +? v det ) t plh =-1c ct r ct ln c ct : c t pin externally attached capacitance v cth : c t pin threshold voltage(p.3 v cth refer.) r ct : c t pin internal impedance(p.3 r ct refer.) ln: natural logarithm reference data of falling time (t phl ) output examples of falling time (t phl ) output part number t phl [s] bu4245 275.7 bu4345 359.3 * this data is for reference only. the figures will vary with the application, so pleas e confirm the actual operating conditions before use. timing waveforms example: the following shows the relationship between the input voltage v dd , the c t terminal voltage v ct and the output voltage v out when the input power supply voltage v dd is made to sweep up and sweep down (the circuits are shown in fig.15 and 16). when the power supply is turned on, the output is unstable from after over the operating limit voltage (v opl ) until t phl . therefore, it is possible that the reset signal is not outputted when the rise time of v dd is faster than t phl . when v dd is greater than v opl but less than the reset release voltage (v det +?v det ), the c t terminal (v ct ) and output (v out ) voltages will switch to l. if v dd exceeds the reset release voltage (v det +v det ), then v out switches from l to h (with a delay to the c t terminal). if v dd drops below the detection voltage (v det ) when the power supply is powered down or when there is a power supply fluctuation, v out switches to l (with a delay of t phl ). the potential difference between the detection voltage and the release voltage is known as the hysteresis width (v det ). the system is designed such that the output does not toggle with power supply fluctuations within this hysteresis width, preventing malfunctions due to noise. vref v dd gnd ct r1 r2 r3 q3 q1 v out reset v dd vref v dd gnd ct r1 r2 r3 q3 q2 v out reset q1 v dd v dd -v cth v dd v dd v det + <1 v det v det v opl 0v 1/2 v dd t phl ?r t plh t phl t plh ?s ?t ?u ?v v ct v out fig.17 timing waveforms
datasheet datasheet 11/13 bu42xx series bu43xx series tsz02201-0r7r0g300050-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.aug.2013 rev.007 www.rohm.com tsz22111 ? 15? 001 circuit applications 1) examples of common power supply detection reset circuits application examples of bu42xx series (open drain output type) and bu43xx series (cmos output type) are shown below. case1: power supply of microcontroller (v dd 2) differs from the power supply of the reset detection (v dd 1 ). use an open drain output type (bu42xx series) device with a load resistance r l as shown fig.18. case2: power supply of microcontroller (v dd 1 ) is the same as the power supply of the reset detection (v dd 1 ). use a cmos output type (bu43xx series) device or an open drain output type (bu42xx series) device with a pull up resistor between the output and v dd 1. when a capacitance c l for noise filtering is connected to vou t pin (the reset signal input terminal of the microcontroller), please take into account the waveform of the rise and fall time of the output voltage (vou t ). 2) the following is an example of a circuit application in which an or connection between two types of detection voltage resets the microcontroller. to reset the microcontroller when many independent power supplies are used in the system, or connect an open drain output type (bu42xx series) to the microcontroller?s input with pull-up resistor to the supply voltage of the microcontroller (v dd3 ) as shown in fig. 20. by pulling-up to v dd3 , output ?high? voltage of micro-controller power supply is possible. v dd1 bu43xx c in gnd c t r st c l (capacitor for noise filtering) micro controller fig.19 cmos output type v dd1 bu42xx v dd2 gnd r st c l (capacitor for noise filtering) c t r l c in micro controller fig.18 open drain output type v dd1 v dd3 gnd r st microcontroller c t r l v dd2 c t bu42xx no.1 bu42xx no.2 fig.20
datasheet datasheet 12/13 bu42xx series bu43xx series tsz02201-0r7r0g300050-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.aug.2013 rev.007 www.rohm.com tsz22111 ? 15 ? 001 3) examples of the power supply with resistor dividers in applications wherein the power supply input terminal (vdd) of an ic has resistor dividers, it is possible that an in-rush current will momentarily flow into the circuit when the output logic switches, resulting in malfunctions (such as output oscillations). (in-rush current is a current that momentarily flows from the power supply (vdd) to ground (gnd) when the output level switches from ?high? to ?low? or vice versa.) fig.21 a voltage drop [in-rush current (i1)] [input resistor (r2)] is caused by the in-rush current, and causes the input voltage to drop when the output switches from ?low? to ?high?. wh en the input voltage decreases and falls below the detection voltage, the output voltage switches from ?high? to ?low?. at this time, the in-rush current stops flowing through output ?low?, and the voltage drop is reduced. as a result, the out put switches from ?low? to ?high?, which again causes the in-rush current to flow and the voltage to drop. this operation repeats and will result to oscillation. consider the use of bd52xx when the power supply input has resistor dividers. fig.22 current consumption vs. power supply voltage * this data is for reference only. the figures will vary with the application, so please confirm the actual operating conditions before use. v out r2 v d d bu42xx bu43xx gnd r1 i1 v1 cin c l i dd v dd v det 0 through current vdd - idd peak current ta=25c 0.001 0.01 0.1 1 10 345678910 vdd[v] idd-peak[ma] bu49xx,bu43xx bu48xx,bu42xx bd52xx bd53xx temp - idd(bu42xx) 0.0 0.5 1.0 1.5 2.0 2.5 -50 -30 -10 10 30 50 70 90 110 130 temp idd peak current[ma] vdd3v vdd6v vdd7v vdd4v
datasheet datasheet 13/13 bu42xx series bu43xx series tsz02201-0r7r0g300050-1-2 ? 2013 rohm co., ltd. all rights reserved. 2.aug.2013 rev.007 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1) absolute maximum ratings operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. 2) ground voltage the voltage of the ground pin must be the lowest voltage of all pins of the ic at all operating conditions. ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. 3) recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 4) bypass capacitor for noise rejection to help reject noise, put a 1f capacitor between v dd pin and gnd and 1000pf capacitor between v out pin and gnd. be careful when using extremely big capacitor as transient response will be affected. 5) short between pins and mounting errors be careful when mounting the ic on printed circuit boards. the ic may be damaged if it is mounted in a wrong orientation or if pins are shorted together. short circuit may be caused by conductive particles caught between the pins. 6) operation under str ong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 7) the v dd line impedance might cause oscillation because of the detection current. 8) a v dd to gnd capacitor (as close connection as possible) should be used in high v dd line impedance condition. 9) lower than the mininum input voltage puts the v out in high impedance state, and it must be v dd in pull up (v dd ) condition. 10) external parameters the case of needless ?delay time?, recommended to insert more 470k ? resister between v dd and c t . the recommended value of r l resistor is over 50k ? to 1m ? for v det =1.5v to 4.8v, and over 100k ? to 1m ? for v det =0.9v to 1.4v. the recommended value of c t capacitor is over 100pf to 0.1f. there are many factors (board layout, etc) that can affect characteristics. please veri fy and confirm using practical applications. 11) power on reset operation please note that the power on reset output varies with the v dd rise time. please verify the behavior in the actual operation. 12) testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic durin g assembly and use similar precautions during transport and storage. 13) rush current when power is first supplied to the ic, rush current may flow instantaneously. it is possible that the charge current to the parasitic capacitance of internal photo diode or the in ternal logic may be unstable. therefore, give special consideration to power coupling capacitance, power wi ring, width of gnd wiring, and routing of connections. 14) c t pin discharge due to the capabilities of the c t pin discharge transistor, the c t pin may not completely discharge when a short input pulse is applied, and in this case the delay time may not be controlled. please verify the actual operation. 15) this ic has extremely high impedance terminals. small l eak current due to the uncleanness of pcb surface might cause unexpected operations. application values in these conditions should be selected carefully. if 10m ? leakage is assumed between the c t terminal and the gnd terminal, 1m ? connection between the ct terminal and the v dd terminal would be recommended. also, if the leakage is assumed between the vout terminal and the gnd terminal, the pull up resistor should be less than 1/10 of the assumed leak resistance. the value of rct depends on the external resistor that is connected to c t terminal, so please consider the delay time that is decided by t r ct c ct changes.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

▲Up To Search▲

Price & Availability of BU4329G-TR

	To Download BU4329G-TR Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .